Selected Work

Projects that
delivered results.

A selection of engagements across PCBA manufacturing, DFM review, web design, and product development. Details adjusted where NDA applies.

A note on confidentiality: Many clients operate in defense, aerospace, and other regulated industries where project details are sensitive. Where an NDA is in place, company names and specific technical details have been abstracted. The scope, challenge, and outcome described are accurate.
STENCIL APERTURES <75% FPY >99% FPY
Solder Paste
Stencil DesignSPIPaste Selection

Solder Paste First Pass Yield Recovery

Root-caused chronically poor solder paste printing yield on a complex mixed-component board. Redesigned stencil apertures for area ratio compliance, selected an optimized paste chemistry for the thermal profile, and tuned SPI accept/reject thresholds. Implemented a formal stencil qualification and replacement protocol.

First pass yield improved from <75% to >99%
BGA — TOP VIEW VIP ISSUE AR FAIL ISSUES CAUGHT PRE-FAB
DFM Review
DefenseBGADFM

Defense Electronics BGA DFM Review

Pre-production Gerber review for a ruggedized defense board with multiple high-density BGAs. Identified via-in-pad escape routing issues, stencil aperture area ratio failures for fine-pitch components, and thermal relief inadequacies near a large copper pour.

Three critical issues resolved before first article — no costly respins
PREHEAT REFLOW COOL TPEAK NEW ALLOY QUALIFIED 25°C
NPI / Materials
NPIMaterial QualReflow

Solder Material Migration & NPI Qualification

Led qualification and line-wide rollout of a new solder paste alloy to address recurring reflow oven clogging defects impacting uptime and yield. Managed compatibility testing across multiple board designs, reflow profile re-characterization, and cross-functional coordination with supply chain and production teams. Process documentation and training materials authored for full team deployment.

Reflow clogging defects eliminated; significant annual savings in energy and downtime
X-RAY VIEW VOID DETECTED INSPECTION SOP 1. Acquisition params 2. Void criteria IPC-7095 3. BGA cross-section 4. NCR documentation
DFM / X-Ray
High-ReliabilityX-RayAXI

X-Ray Inspection SOP Development

Developed a comprehensive X-ray inspection SOP for high-reliability PCBA assemblies. Covered image acquisition parameters, void acceptance criteria per IPC-7095, BGA cross-section interpretation, and non-conformance documentation workflow.

SOP adopted as standard across production and quality teams
gvttc.vercel.app LADDER RANKINGS #1Player AW:12 L:21850 pts #2Player BW:10 L:41720 pts #3Player CW:9 L:51640 pts #4Player DW:8 L:61590 pts React · Supabase · Vercel · CI/CD
Web Design
ReactVercelSports App

Table Tennis League Web App

Full rebuild of a regional table tennis league management platform. Features ladder rankings, match result entry, badge award system, and player profiles. Built on React with Supabase backend and deployed on Vercel with automatic CI/CD.

Active league management across multiple seasonal divisions
CROSS-SECTION — CONFORMAL COAT FR4 SUBSTRATE COATING REPAIR & RECOAT SOP IPC-CC-830 ACCEPTANCE CRITERIA
Polymeric
Conformal CoatingSOPHigh-Reliability

Conformal Coating Repair & Recoating SOP

Developed a repair and touch-up SOP for conformal coating removal and recoating on high-reliability PCBA assemblies. Covered blast media selection, masking procedures, cure verification, and IPC-CC-830 acceptance criteria.

SOP qualified for use on high-reliability hardware

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